Apple’s exclusive manufacturer of the A-series processors in iPhones, TSMC, is to unveil its forthcoming 5 nanometer facilities at Mobile World Congress (MWC) on February 25. Following that debut, Apple is reported to place orders for the new, thinner processor that TSMC will be manufacturing them in 2020.
The Taiwan Semiconductor Manufacturing Company has been developing thinner processors through the use of new technology called Extreme Ultraviolet Lithography (EUV). As well as making the processor thinner, this technology allows for the ability to place more onto any one processor given the same volume or surface area.
