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Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’

December 12, 2018

Via: The Verge
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At an Architecture Day event hosted this week, Intel articulated an unusually lucid strategy for its development of future processors, most of which will revolve around fragmenting the various elements of a modern CPU into individual, stackable “chiplets.” Intel’s big goal for late 2019 is to offer products built on what it calls Foveros 3D stacking: an industry-first implementation of stacked processing components inside a chip. We’ve already seen stacked memory; now, Intel is doing something similar with the CPU, allowing its designers to essentially drop in extra processing muscle atop an already assembled chip die.

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